C-Grid III™ Kits

C-Grid IIIâ„¢, is a 3rd generation 2.54mm (.100") pitch post and receptacle interconnection system offering complete design flexibility with modular components that provide the widest range of electronic packaging alternatives. C-Grid III is highly-versatile with unique design features and options: like 3 Surface Treatments (platings), Termination Flexibility (Solder Tail, Crimp and Insulation Displacement combined), Advantage by Design offers the same mating concept with all termination techniques allowing full interchangeability inside different housing styles), Interchangeability (fully compatible with the industry standard DIN41651 as well as the French norm HE-13/14), and Lower Applied Cost.